Özet:

It is a common method to apply a certain pressure to the bonded surfaces while bonding. In this way, it is ensured that the adhesive covers all surfaces and the air in the adhesive is evacuated. However, the effects of pressure changes on the curing process and mechanical properties, especially in adhesives that harden by chemical reaction, are an issue that should be handled with numerical data at a scientific level. When the literature is examined, there are limited studies on the effects of curing pressure on mechanical properties of adhesive joints. In this study, the effect of curing pressure on bond strength in adhesive joints was investigated experimentally. Single lap adhesive joints were manufactured using steel plate and DP460 epoxy. At this stage, bonding joints with different curing pressure conditions were obtained by placing weights on the adhesive area. The samples were subjected to tensile tests. In consequence of the experiments, a reducing in the joint endurance was observed after a certain pressure value. Thus, it has been understood that the pressure applied to the adhesive area affects the curing process, and must be taken within certain limits.

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