Abstract:

Because of the fabrication techniques, mechanical properties of the materials used in micro electromechanical systems should be determined by utilizing micro-scale test structures. In this study, a micro bending test structure, whose actuator, sample, and readout scale are integrally fabricated on a single chip is presented. Integrated fabrication of all components eliminates the alignment problem observed in similar systems. The structure relies on the principle of bending a double-clamped beam from its center by using an electrostatic comb drive. Deflection amount is determined by using image processing techniques on the read-out scale. Designed structures are fabricated by using silicon-oninsulator wafers. As a result of the tests, elastic modulus of silicon is determined as 136 GPa in accordance with the literature. 

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