Abstract:

: The miniaturization of electronic components leads to poor heat dissipation, performance, and reliability of the devices. To optimize heat transfer from electrical components, pin fins are the best choice due to their high thermal conductivity. Different configurations of square and triangular pin fins for heat transfer characteristics were numerically investigated in this study. Three-dimensional numerical simulations were carried out for two different configurations with heat fluxes of 0.82 kW/m 2 subjected to the base of the heat sink. The heat transfer coefficients among the numerical simulation study and experimentation results provided a good correlation. To evaluate the overall performance, it was indicated from both numerical and experimental results that the maximum square pin fin configuration reduced the base temperature by up to 17.7% and 19%, respectively. In comparison to other configurations, the square pin fin performed better because of its increased surface area.

Keywords: