Abstract:

Beside extensive successful use of epoxy resins in many applications such as electronic packaging, insulation, adhesives and laminate technologies with various advantages; their low thermal conductivity and high CTE (thermal expansion coefficient) limit their performance. However, the addition of the particles into this material can significantly improve the constitutive and thermal properties. In this context, this study aims to develop an adhesive material where the epoxy resin is considered as the matrix material which is filled with Hexagonal Boron Nitride (h-BN) particles. Moreover, we characterize thermal behavior of the developed composite structure. A facile synthesis method was developed for minimizing the void formation while achieving a homogenous distribution of h-BN particles. SEM analysis has been employed to study the effect of the h-BN particles on the microstructural morphology. In addition, DMA (Dynamic Mechanical Analysis) and DSC (Differential Scanning Calorimeter) techniques were employed to examine the glass transition and viscoelastic mechanical behavior. The obtained results are consistent with the existing ones in the literature.

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