Abstract:

Thermoelectric modules (TEM) without moving parts are systems that can create a cooling effect in a short time, operate quietly and most importantly do not require working fluids for cooling. In the current study, TEM selection and design were made for 300 W cooling requirement. The voltage and current values that maximize the Coefficient of Performance (COP) were investigated. It is known that the cooling effects of the thermoelectric modules are directly proportional to the effective cooling of the hot side of the thermoelectric module. In this respect, the heat sinks and fan combinations were analyzed and optimized to cool the hot side of the TEM. Different fan speeds, heat sink geometries, and heat sink locations were discussed to cool the hot side. Heat sink dimensions were optimized for specific air velocity and the thermal resistance of the thermal paste was also considered. In addition to the heat sinks and fan combinations, the water-cooling systems were investigated for the cooling of the hot side of the TEMs. Different channel designs have been considered to regulate the flow of cooling water. Considering the thermal paste effects and leakage risk in the designs, direct-contact and non-contact water-cooled designs have been realized. In the non-contact design, the effects of aluminum and copper materials on heat transfer were discussed addition to the impact of geometry. The vortex generators were investigated to increase the heat transfer coefficient in direct-contact designs.

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